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Current Research

Evaluation and Modeling of Next Generation Electronics Cooling Technologies

Sponsors: 1. Nextreme Thermal Solutions
2. Ontario Centres of Excellence
Start Date: November 1, 2006

Project Description:

Design and develop test procedures for evaluating the performance of TEC devices, including coefficient of performance (thermodynamic energy balance of heat energy removed versus electrical energy consumed), power generation capabilities, thermal conductivity and contact resistance. Conduct laboratory testing to assess the thermal performance of new technologies for electronics cooling such as pulsating heat pipes, spray cooling, microchannel heat sinks and microjets. Enhance existing analytical simulation tools developed by the MHTL and design and implement new tools into a comprehensive suite of simulation tools that can be used by the electronics design community at large.