Thermal Interface Material Test Rig | |
Contact: | 1. Pete Teertstra (519 888-4567 x35610 or Email) |
2. Rick Culham (519 888-4567 x33839 or Email) | |
Location: | Engineering 3, Room 2133 |
Description: |
Compliant thermal interface materials do not generally adhere to these constraints. To accurately measure the material thickness as it changes during testing a thermal interface test rig has been designed and manufactured in the MHTL. The system uses a Mitutoyo LSM 503H laser micrometer to measure in-situ thickness during the dynamic loading of the TIM. For most materials, submicron thickness measurements are possible. One inch square samples can be tested over an operating range of 10 - 90 C mean interface temperature, 10 - 1000 psi interface pressure for heat fluxes up to 16 W/cm2. Thermal conductivities are then accurately determined based on the material thermal resistance and the actual thickness of the sample during the testing sequence. |