The MHTL was established in 1984 to meet the heat transfer needs of an evolving microelectronics community. For the past 27 years, we have provided research services related to analytical modeling, materials characterization and experimental testing for a wide range of companies from start-ups to multi-nationals.
Research projects in the MHTL are supported by industry (current sponsors include: Nextreme Thermal Solutions, Celestica, Dy4) and government (current sponsors include: Natural Sciences and Engineering Research Council of Canada, Ontario Centres of Excellence and the Centre for Microelectronics Assembly and Packaging). These projects include testing and characterization of thermal interface materials, modeling and testing of thermal electric devices for power generation and heat transfer, and modeling of microscale thermal processes.
Richard Culham
Director, MHTL
Microelectronics Heat Transfer Laboratory
Department of Mechanical Engineering
University of Waterloo
200 University Avenue West
Waterloo, Ontario, Canada N2L 3G1
PH: 519 888 4586
FAX: 519 746 9141
http://www.mhtlab.uwaterloo.ca