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Professional Service

Editorial

  1. Special Editor, ASME Journal of Electronic Packaging,, February 2006.

  2. Special Editor, IEEE Journal of Components and Packaging Technology,, Vol. 28, No. 2, 2005.

  3. Co Editor, Proceedings for ITHERM, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004.

  4. Special Editor, ASME Journal of Electronic Packaging,, Vol. 125, No. 2, 2003.

  5. Special Editor, IEEE Journal of Components and Packaging Technology,, Vol. 24, No. 2, 2001.

  6. Co Editor, Proceedings for ITHERM, The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 23-26, 2000.

Committees

  1. International Electronics Manufacturing Initiative (iNEMI), 2005, Heat Transfer Formation Committee.

  2. International Electronics Manufacturing Initiative (iNEMI), Road Map 2004, Thermal Work Group.

  3. ASTM, Review Committee for D 5470, Test Procedure for Thermal Interface Materials.

  4. ASME K16, Committee on Heat Transfer in Electronic Equipment

  5. Centre for Microelectronics Assembly and Packaging (CMAP), Technical Advisory Committee