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Culham Technical Paper Archive

 

2007
  • Role of Random Roughness on Thermal Performance in Micro-Fins
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 21, No. 1, January-March, 2007, pp. 153 - 157. Also presented in Proceedings of HT2005, 2005 Heat Transfer Conference, San Francisco, CA, July 17-22, 2005.
    [pdf]

  • A Novel Solution for Pressure Drop in Singly Connected Microchannels of Arbitrary Cross-Section
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    International Journal of Heat And Mass Transfer, Vol. 50, Issues 13-14, July 2007, pp. 2492 - 2502.
    [pdf]

  • Optimal Design of Tube Banks in Crossflow Using Entropy Generation Minimization Method
    Khan, W.A., Culham, J.R., and Yovanovich, M.M.
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 21, No. 2, April-June 2007, pp. 372 - 378. Also presented at AIAA 44th Aerospace Sciences Meeting and Exhibit, Reno, NV, January 9-12, 2006.
    [pdf]

  • Influence of Bypass on Flow Through Plate Fin Heat Sinks
    Hossain, R., Culham, J.R. and Yovanovich, M.M.
    Twenty Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), San Jose, CA, March 18-22, 2007.
    [pdf]

  • The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks,
    Culham, J.R., Khan, W., Yovanovich, M.M., and Muzychka, Y.S.
    ASME Journal of Electronic Packaging, Vol. 129, March, 2007, pp. 76 - 81. Also presented at NHTC2001-20019, Fundamentals of Heat Transfer Modes Applied to Electronics Cooling, Proceedings of NHTC'01, ASME 35th National Heat Transfer Conference, Anaheim, CA, June 10-12, 2001.
    [pdf]

  • Assessment of Relevant Physical Phenomena Controlling Thermal Performance of Nanofluids,
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.
    Journal of Thermophysics and Heat Transfer, Vol. 21, No. 4, October - December, 2007, pp. 673 - 680.
    [pdf]

2006
  • Analytical Modeling of Natural Convection in Concentric Spherical Enclosures,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 20, No. 2, April-June, 2006.
    [pdf]

  • Pressure Drop of Laminar, Fully Developed Flow in Rough Microtubes,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R.,
    ASME Journal of Fluids Engineering, Vol. 128, No. 3, 2006, pp. 632-637. Also presented as Paper No. ICMM2005-75108, ASME 3rd International Conference on Mini and Microchannels, Toronto, ON, June 13-15, 2005.
    [pdf]

  • Influence of Geometry and Edge Cooling on Thermal Spreading Resistance,
    Muzychka, Y.S., Yovanovich, M.M. and Culham, J.R.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 20, No. 2, April-June, 2006, pp. 247-255.
    [pdf]

  • Natural Convection Measurements for a Concentric Spherical Enclosure,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    ASME Journal of Heat Transfer, Vol. 128, No. 6, 2006, pp. 580-587. Originally presented in Proceedings of IMECE 2002, International Mechanical Congress and Exposition, New Orleans, Louisiana, November 17-22, 2002.
    [pdf]

  • Modeling of Natural Convection in Electronic Enclosures,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    ASME Journal of Electronic Packaging, Vol. 128, June, 2006, pp. 157-165. Originally presented at the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, USA, June 1-4, 2004.
    [pdf]

  • Effective Thermal Conductivity of Rough Spherical Packed Beds,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R.,
    International Journal Of Heat and Mass Transfer, Vol. 49, Issue 19-20, pp. 3691-3701. Also presented as Paper No. IMECE2004-60129, ASME International Mechanical Engineering Congress, Anaheim, CA, Nov. 13-19, 2004.
    [pdf]

  • Review of Thermal Joint Resistance Models for Non-Conforming Rough Surfaces,
    Bahrami, M., Culham, J.R., Yovanovich, M.M. and Schneider, G.E.,
    ASME Applied Mechanics Reviews, Vol. 59, No. 1, pp. 1-12. Originally presented at ASME Heat Transfer Conference, Las Vegas Nevada, July 21-23, 2003.
    [pdf]

  • Analytical Study of Heat Transfer from Circular Cylinder in Liquid Metals,
    Khan, W. A., Culham, J.R., and Yovanovich, M.M.,
    Journal of Heat and Mass Transfer, Vol. 42, No. 11, 2006, pp. 1017 - 1023.
    [pdf]

  • Performance of Shrouded Pin-Fin Heat Sinks for Electronic Cooling,
    Khan, W. A., Culham, J.R., and Yovanovich, M.M.,
    Journal of Thermophysics and Heat Transfer, Vol. 20, No. 3, 2006, pp. 408 - 414.
    [pdf]

  • Fluid Flow and Heat Transfer in Power-law Fluids Across Circular Cylinders: Analytical Study,
    Khan, W. A., Culham, J.R., and Yovanovich, M.M.,
    ASME Journal of Heat Transfer, Vol. 128, September 2006, pp. 870 - 878.
    [pdf]

  • Analytical Model for Convection Heat Transfer from Tube Banks,
    Khan, W.A., Culham, J.R. and Yovanovich, M.M.,
    Journal of Thermophysics and Heat Transfer, Vol. 20, No. 4, October-December, pp. 720 - 727. Also presented at AIAA 43rd Aerospace Sciences Meeting and Exhibit, Reno, NV, January 10-13, 2005.
    [pdf]

  • Assessment of Relevant Physical Phenomena Controlling Thermal Performance of Nanofluids,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R
    ASME International Mechanical Engineering Congress and RD Expo, Chicago, IL, Nov. 5-10, 2006.
    [pdf]

  • Optimization of Microchannel Heat Sinks Using Entropy Generation Minimization Method,
    Khan, W.A., Yovanovich, M.M. and Culham, J.R
    Twenty Second Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), Dallas, TX, March 14-16, 2006.
    [pdf]

  • Thermal Resistance-Based Bounds for the Effective Conductivity of Composite Thermal Interface Materials,
    Karayacoubian, P., Yovanovich, M.M. and Culham, J.R
    Twenty Second Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), Dallas, TX, March 14-16, 2006.
    [pdf]

  • Effect of Bypass on Overall Performance of Pin Fin Heat Sinks,
    Khan, W.A., Yovanovich, M.M. and Culham, J.R.
    9th AIAA/ASME Joint Thermophysics and Heat Transfer Converence, San Francisco, CA, June 5 - 8, 2006.
    [pdf]

  • Approximate Solution for Pressure Drop In Microchannels of Arbitrary Cross-Section,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R.
    9th AIAA/ASME Joint Thermophysics and Heat Transfer Converence, San Francisco, CA, June 5 - 8, 2006.
    [pdf]

  • Convection Heat Transfer from Tube Banks in Crossflow: Analytical Approach
    Khan, W.A., Culham, J.R., and Yovanovich, M.M.
    International Journal of Heat and Mass Transfer, Vol. 49, pp. 4831 - 4838, 2006.
    [pdf]

  • The Role of Fin Geometry in Heat Sink Performance,
    Khan, W., Culham, J.R. and Yovanovich, M.M.,
    ASME Journal of Electronic Ppackaging, Vol. 128, December, 2006, pp. 324 - 330. Also presented at InterPACK2003-35014, International Electronic Packaging Technical Conference and Exhibit, Maui, Hawaii, July 6-11, 2003.
    [pdf]

2005
  • Analytical Modeling of Natural Convection in Horizontal Annuli,
    Teertstra, P., Yovanovich, M.M., and Culham, J.R.,
    AIAA 43rd Aerospace Sciences Meeting and Exhibit, Reno, NV, January 10-13, 2005.
    [pdf]

  • Pressure Drop of Fully-Developed, Laminar Flow in Rough Microtubes,
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    MICROMINI 2005, 3rd International Conference on Microchannels and Minichannels, Toronto, Canada, June 13-15, 2005.
    [pdf]

  • Pressure Drop of Fully-Developed, Laminar Flow in Microchannels of Arbitrary Cross-section,
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    MICROMINI 2005, 3rd International Conference on Microchannels and Minichannels, Toronto, Canada, June 13-15, 2005.
    [pdf]

  • Review of Experimental Procedure for Determining Liquid Flow in Microchannels,
    Ferguson, A.D., Bahrami, and Culham, J.R.,
    MICROMINI 2005, 3rd International Conference on Microchannels and Minichannels, Toronto, Canada, June 13-15, 2005.
    [pdf]

  • Thermal Contact Resistance: Effect of Elastic Deformation,
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    International Journal of Heat and Mass Transfer, Vol. 48, 2005, pp. 3284 - 3293. Also presented in Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), San Jose, CA, March 15-17, 2005, pp. 44 - 52.
    [pdf]

  • In-Situ Thickness Method of Measuring Thermo-Physical Properties of Polymer-Like Thermal Interface Materials,
    Smith, R.A. and Culham, J.R.,
    Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), San Jose, CA, March 15-17, 2005, pp. 53 - 63.
    [pdf]

  • Modeling of Cylindrical Pin-Fin Heat Sinks for Electronic Packaging,
    Khan, W.A., Culham, J.R. and Yovanovich, M.M.
    Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), San Jose, CA, March 15-17, 2005, pp. 125 - 134.
    [pdf]

  • Fluid Flow and Heat Transfer from Elliptical Cylinders: Analytical Approach,
    Khan, W.A., Culham, J.R. and Yovanovich, M.M.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 19, No. 2, 2005. Originally presented at the AIAA 37th Thermophysics Conference, Portland, OR, June 29 - July 1, 2004.
    [pdf]

  • Modeling Transient Conduction in Enclosed Regions Between Isothermal Boundaries of Arbitrary Shape,
    Teertstra, P., Yovanovich, M.M., and Culham, J.R.
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 19, No. 3, 2005, pp. 382 - 387.
    [pdf]

  • Thermal Modeling of Driver/Seat Interfaces in Automotive Applications,
    Karimi, G., Chan, E.C. and Culham, J.R.,
    SAE Transactions, Journal of Materials and Manufacturing, 2005. Also presented as Paper No. DHMC04-73, Digital Human Modeling Conference, Society of Automotive Engineers, Oakland, MI, June 14-16, 2004.
    [pdf]

  • Optimization of Pin Fin Heat Sinks Using Entropy Generation Minimization
    Khan. W.A., Culham, J.R. and Yovanovich, M.M.,
    IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 2, 2005, pp. 247 - 254. Also presented in Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, USA, June 1-4, 2004.
    [pdf]

  • Fluid Flow and Heat Transfer in Power-Law Fluids Across Circular Cylinders - Analytical Study
    Khan. W.A., Culham, J.R. and Yovanovich, M.M.,
    ASME IMECE, Orlando, Florida, November 5-11, 2005
    [pdf]

  • Convective Heat Transfer for Fully-developed, Laminar Flow in Rough Microtubes
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    Paper No. IMECE2005-79902, ASME IMECE, Orlando, Florida, November 5-11, 2005
    [pdf]

  • Asymptotic Solutions of Effective Thermal Conductivity of Particle-Laden Polymers
    Karayacoubian, P., Bahrami, M., and Culham, J.R.,
    Paper No. IMECE2005-82734, ASME IMECE, Orlando, Florida, November 5-11, 2005
    [pdf]

  • Gaussian Roughness in Thermal Contact Conductance, Microtubes and Microfins
    Yovanovich, M.M., Bahrami, M., and Culham, J.R.,
    Paper No. HT2005-72850, Proceedings of HT2005, 2005 Heat Transfer Conference, A Symposium in Honor of Bora Mikic, San Francisco, CA, July 17-22, 2005.
    [pdf]

  • Role of Random Roughness on Thermal Performance in Micro-Fins
    Yovanovich, M.M., Bahrami, M., and Culham, J.R.,
    Proceedings of HT2005, 2005 Heat Transfer Conference, San Francisco, CA, July 17-22, 2005.
    [pdf]

  • A Compact Model for Spherical Rough Contacts,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R.,
    ASME Journal of Tribology, Vol. 127, No. 4, 2005,pp. 884 - 889. Originally presented as TRIB2204-64015, ASME/STLE International Joint Tribology Conference, Long Beach, CA, October 24-27, 2004.
    [pdf]

  • Fluid Flow Around and Heat Transfer from an Infinite Circular Cylinder,
    Khan, W.A., Culham, J.R. and Yovanovich, M.M.,
    ASME Journal of Heat Transfer, Vol. 127, July, 2005, pp. 785 - 790.
    [pdf]

  • Conduction Shape Factor Models for Three-Dimensional Enclosures,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 19, No. 4, October-December, 2005, pp. 527-532. Also presented at AIAA2003-0159, 41st AIAA Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 6-9, 2003.
    [pdf]

2004
  • Modeling Thermal Contact Resistance: A Scale Analysis Approach,
    Bahrami, M., Culham, J.R. and Yovanovich, M.M.,
    ASME Journal of Heat Transfer, Vol. 126, December, 2004, pp. 896-905. Originally presented at ASME International Mechanical Engineering Congress and RD Expo, Washington, DC, Nov. 15-21, 2003.
    [pdf]

  • Thermal Joint Resistances of Conforming Rough Surfaces with Gas-Filled Gaps,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 18, No. 3, July-Sept., 2004, pp. 318-325. Originally presented at 42nd AIAA Aerospace Sciences Meeting and Exhibit, January 5-8, Reno, NV, 2004.
    [pdf]

  • Thermal Joint Resistance of Non-Conforming Rough Surfaces with Gas-filled Gaps,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 18, No. 3, July-Sept., 2004, pp. 326-332. Originally presented at 42nd AIAA Aerospace Sciences Meeting and Exhibit, January 5-8, Reno, NV, 2004.
    [pdf]

  • Fluid Flow and Heat Transfer from a Cylinder Between Parallel Planes: Analytical Approach,
    Khan, W.A., Culham, J.R. and Yovanovich, M.M.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 18, No. 3, 2004, pp. 395-403. Originally presented at AIAA 42nd Aerospace Sciences Meeting and Exhibit, Reno, NV, January 5-8, 2004.
    [pdf]

  • Experimental Study and Thermal Modeling of an Automobile Driver with a Heated and Ventilated Seat
    Karimi, G., Chan, E. and Culham, J.R.,
    Journal of Passenger Cars - Electronic and Electrical Systems, Vol. 112, No. 7, SAE 2003 Transactions, pp. 682-692.
    [pdf]

  • Thermal Contact Resistance of Non-Conforming Rough Surfaces Part 1: Contact Mechanics Model,
    Bahrami, M., Culham, J.R., Yovanovich, M.M. and Schneider, G.E.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 18, No. 2, April-June, 2004, pp. 209-217. Originally presented at 36th AIAA Thermophysics Conference, Orlando, Florida, June 23-26, 2003.
    [pdf]

  • Thermal Contact Resistance of Non-Conforming Rough Surfaces Part 2: Thermal Model,
    Bahrami, M., Culham, J.R., Yovanovich, M.M. and Schneider, G.E.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 18, No. 2, April-June, 2004, pp. 218-227. Originally presented at 36th AIAA Thermophysics Conference, Orlando, Florida, June 23-26, 2003. Accepted: August 13, 2003.
    [pdf]

  • Compact Analytical Models for Effective Thermal Conductivity of Rough Spheroid Packed Beds,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R.,
    ASME International Mechanical Engineering Congress, Anaheim, CA, November 13-19, 2004.
    [pdf]

  • Pulsating Heat Pipe Mechanism for High Heat Flux Electronic Cooling,
    Karimi, G. and Culham, J.R.,
    Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, USA, June 1-4, 2004.
    [pdf]

  • Modeling of Natural Convection in Electronic Enclosures,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, USA, June 1-4, 2004.
    [pdf]

  • Experimental and Analytical Investigation of Compact Liquid Cooled Heat Sinks,
    Zugic, M.J., Culham, J.R., Teertstra, P., Muzychka, Y.S., Horne, K., Knapp, E. and De Palma, J.-F.,
    ASME International Mechanical Engineering Congress, Anaheim, CA, November 13-19, 2004.
    [pdf]

  • Models and Experiments for Laminar Natural Convection from Heated Bodies in Enclosures,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    Paper No. HT-FED04-56633, ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC, July 11-15, 2004.
    [pdf]

  • Mechanical/Thermal Simulation of Passenger-loaded Vehicle Seat in Severe Winter Conditions,
    Chan, E.C., Karimi, G., Rose, D. and Culham, J.R.,
    Society of Automotive Engineers SAE 2004 World Congress, Detroit, MI, March 8-11, 2004.
    [pdf]

  • Analytical Modeling of Natural Convection in Concentric Spherical Enclosures,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    Paper No. AIAA2004-0496, 42nd AIAA Aerospace Sciences Meeting and Exhibit, Reno, NV, January 5-8, 2004.
    [pdf]

  • Thermal Spreading Resistance in Compound and Orthotropic Systems,
    Muzychka, Y.S., Yovanovich, M.M. and Culham, J.R.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 18, No. 1, January-March, pp. 45-51.
    [pdf]

2003
  • Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels,
    Muzychka, Y.S., Culham, J.R. and Yovanovich, M.M.,
    ASME Journal of Electronic Packaging, Vol. 125, No. 2, 2003, pp. 178-185. Originally presented at ASME International Mechanical Engineering Congress and Exposition, Orlando, FL, November 5-10, 2000.
    [pdf]

  • Effect of Surface Asperity Truncation on Thermal Contact and Gap Conductances,
    Milanez, F., Yovanovich, M.M. and Culham, J.R.,
    IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, 2003, pp 48-54. Originally presented at ITherm, the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29 - June 1, 2002.
    [pdf]

  • Review of Thermal Conductance Models for Joints Incorporating Enhancement Materials,
    Savija, I., Culham, J.R, Yovanovich, M.M. and Marotta E.E.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 17, No. 1, Jan.-Mar., 2003, pp. 43-52. Originally presented at the 40th AIAA Aerospace Sciences Meeting and Exhibit, Reno, NV, January 14-17, 2002.
    [pdf]

  • Thermal Joint Resistance Model for Conforming Rough Surfaces With Grease Filled Interstitial Gaps,
    Savija, I., Yovanovich, M.M., Culham, J.R, and Marotta E.E.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 17, No. 2, Apr.-June, 2003, pp. 278-282. Originally presented at the 40th AIAA Aerospace Sciences Meeting and Exhibit, Reno, NV, January 14-17, 2002.
    [pdf]

  • Experimental Thermal Contact Conductance Bead-Blasted SS 304 at Light Loads,
    Milanez, F.H., Culham, J.R. and Yovanovich, M.M.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 17, No. 4, 2003, pp. 534-542.
    [pdf]

  • Transient Electro-osmotic Pumping in Rectangular Microchannels,
    Karimi, Gholamreza and Culham, J.R.,
    ICMENS 2003, International Conference on MEMS, NANO and Smart Systems, Banff, Alberta, Canada, July 20-23, 2003.
    [pdf]

  • Effective Thermophysical Properties of Thermal Interface Materials: Part I, Definitions and Models,
    Savija, I., Culham, J.R. and Yovanovich, M.M.,
    InterPACK2003-35088, International Electronic Packaging Technical Conference and Exhibit, Maui, Hawaii, July 6-11, 2003.
    [pdf]

  • Effective Thermophysical Properties of Thermal Interface Materials: Part II, Experiments and Data,
    Savija, I., Culham, J.R. and Yovanovich, M.M.,
    InterPACK2003-35264, International Electronic Packaging Technical Conference and Exhibit, Maui, Hawaii, July 6-11, 2003.
    [pdf]

  • Thermal Spreading Resistances in Rectangular Flux Channels Part 1: Geometric Equivalences,
    Muzychka, Y.S., Yovanovich, M.M. and Culham, J.R.,
    AIAA2003-4187, 36th AIAA Thermophysics Conference, Orlando, FL, June 23-26, 2003.
    [pdf]

  • Thermal Spreading Resistances in Rectangular Flux Channels Part 2: Edge Cooling,
    Muzychka, Y.S., Yovanovich, M.M. and Culham, J.R.,
    AIAA2003-4188, 36th AIAA Thermophysics Conference, Orlando, FL, June 23-26, 2003.
    [pdf]

  • Characterization of Mixed Metals Swaged Heat Sinks for Concentrated Heat Sources,
    Zaghlol, A., Leonard, W. and Culham, J.R.,
    The Pacific Rim/ASME International, Intersociety Electronic Packaging Conference, InterPACK'03, Lahaina, Hawaii, July 6-11, 2003.
    [pdf]

  • Experimental Study and Thermal Modeling of an Automobile Driver with a Heated and Ventilated Seat,
    Karimi, G., Chan, E.C. and Culham, J.R.,
    Digital Human Modeling Conference, Montreal, PQ, June, 2003.
    [pdf]

  • The Role of Fin Geometry in Heat Sink Performance,
    Khan, W., Culham, J.R. and Yovanovich, M.M.,
    InterPACK2003-35014, International Electronic Packaging Technical Conference and Exhibit, Maui, Hawaii, July 6-11, 2003.
    [pdf]

  • Conjugate Heat Transfer Measurements for Air-Cooled Electronics - A New Experimental Method,
    Teertstra, P., Urbanski, J.P., Culham, J.R. and Jeakins, W.,
    SEMI-THERM XIX, San Jose, CA, March, 2003.
    [pdf]

  • Conduction Shape Factor Models for 3D Enclosures,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    AIAA2003-0159, 41st AIAA Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 6-9, 2003.
    [pdf]

  • Comparison Between Plastic Contact Hardness Models and Experiments,
    Milanez, F.H., Yovanovich, M.M. and Culham, J.R.,
    AIAA2003-0160, 41st AIAA Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 6-9, 2003.
    [pdf]

  • Fluid Flow and Heat Transfer from a Pin Fin: An Analytical Approach,
    Khan, W.A., Culham, J.R. and Yovanovich, M.M.,
    AIAA2003-0163, 41st AIAA Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 6-9, 2003.
    [pdf]

2002
  • Analytical Forced Convection Modeling of Plate Fin Heat Sinks,
    Teertstra, P., Yovanovich, M.M. and Culham, J.R.,
    Advances in Electronics Cooling, Journal of Electronics Manufacturing, Vol. 10, No. 4, 2002, pp. 253-261.
    [pdf]

  • Characterization of Heat Sink Flow Bypass in Plate Fin Heat Sinks,
    Leonard, W., Teertstra, P., Culham, J.R., and Zaghlol, A.,
    Proceedings of IMECE 2002, International Mechanical Congress and Exposition, New Orleans, Louisiana, November 17-22, 2002.
    [pdf]

  • Thermal Comfort Analysis of an Automobile Driver with Heated and Ventilated Seat,
    Karimi, G., Chan. E.C., Culham, J.R., Linkjacki, I. and Brennan, L.,
    Society of Automotive Engineers, World Congress, Detroit, MI, March 4 - 7, 2002.
    [pdf]

  • Design, Assembly and Commissioning of a Test Apparatus for Characterizing Thermal Interface Materials,
    Culham, J.R., Teertstra, P., Savija, I. and Yovanovich, M.M.,
    Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA USA, May 29 - June 1, 2002.
    [pdf]

  • Forced Convection Heat Transfer for Mixed Metals Swaged Heatsinks,
    Zaghlol. A., Hermann, K., Butler, J., Teertstra, P. and Culham, J.R.,
    Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA USA, May 29 - June 1, 2002.
    [pdf]

  • Modeling Thermal Contact Resistance Between Elastic Hemisphere and Elastic Layer Bonded to Elastic Substrate,
    Stevanovic, M., Yovanovich, M.M. and Culham, J.R.,
    Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA USA, May 29 - June 1, 2002.
    [pdf]

  • Experimental Study on the Hysteresis Effect of Thermal Contact Conductance at Light Loads,
    Milanez, F.H., Culham, J.R. and Yovanovich, M.M.,
    AIAA2002-0787, 40th AIAA Aerospace Sciences Meeting & Exhibit, Reno, NV, January 14-17, 2002.
    [pdf]

2001
  • Modeling Contact Between Rigid Sphere and Elastic Layer Bonded to Rigid Substrate,
    Stevanovic, M., Yovanovich, M.M. and Culham, J.R.,
    IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, 2001, pp. 207-212. Originally presented at ITherm 2000, the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 25-28, 2000.
    [pdf]

  • Optimization of Plate Fin Heat Sinks Using Entropy Generation Minimization,
    Culham, J.R., and Muzychka, Y.S.,
    IEEE Transactions CPT, Vol. 24, No. 2, 2001, pp. 159-165. Originally presented at ITherm 2000, the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, May 25-28, 2000.
    [pdf]

  • Simplified Analytical Models for Forced Convection Heat Transfer from Cuboids of Arbitrary Shape,
    Culham, J.R., Yovanovich, M.M., Teertstra, P., Wang, C.-S., Refai-Ahmed, G. and Tain, R.-M.,
    ASME Journal of Electronic Packaging, Vol. 123, No. 3, 2001, pp. 182-188.
    [pdf]

  • The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks,
    Culham, J.R., Khan, W., Muzychka, Y.S and Yovanovich, M.M.,
    NHTC2001-20019, Fundamentals of Heat Transfer Modes Applied to Electronics Cooling, Proceedings of NHTC'01, ASME 35th National Heat Transfer Conference, Anaheim, CA, June 10-12, 2001.
    [pdf]

  • Application of Thermal Spreading Resistance in Compound and Orthotropic Systems,
    Muzychka, Y.S., Yovanovich, M.M. and Culham, J.R.,
    AIAA2001-0366, AIAA 39th Aerospace Sciences Meeting and Exhibit, Reno, NV, January, 2001.
    [pdf]

2000
  • Natural Convection Modeling of Heat Sinks Using Web-based Tools,
    Culham, J.R., Teertstra, P. and Yovanovich, M.M.,
    Electronics Cooling, Vol. 6, No. 3, 2000, pp. 44-51.
    [pdf]

  • Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution,
    Culham, J.R., Yovanovich, M.M. and Lemczyk, T.F.
    ASME Journal of Electronic Packaging, Vol. 122, No. 3, 2000, pp. 233-239.
    [pdf]

  • The Role of Spreading Resistance on Effective Conductivity in Laminated Substrates,
    Culham, J.R., Teertstra, P. and Yovanovich, M.M.,
    Future Circuits, Vol. 6., 2000, pp. 73-78.
    [pdf]

1999
  • Modeling Natural Convection from Horizontal Isothermal Annular Heat Sinks,
    Wang, C.S., Yovanovich, M.M. and Culham, J.R.,
    ASME Journal of Electronic Packaging, Vol. 121, No. 1, 1999, pp. 44-49.
    [pdf]

  • Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels,
    Yovanovich, M.M., Muzychka, Y.S. and Culham, J.R.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 13, No. 4, Oct.-Dec., 1999, pp. 495-500.
    [pdf]

  • Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks,
    Teertstra, P., Culham, J.R. and Yovanovich, M.M.,
    Future Challenges in Electronics Cooling, ASME International Mechanical Engineering Congress and Exposition, Nashville, TN, Nov. 15-20, 1999.
    [pdf]

  • Analytical Forced Convection Modeling of Plate Fin Heat Sinks,
    Teertstra, P., Yovanovich, M.M., Culham, J.R. and Lemczyk, T.F.,
    Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Diego, CA, March, 1999.
    [pdf]

  • Thermal Wake Effects in Printed Circuit Boards,
    Culham, J.R., Teertstra, P. and Yovanovich, M.M.,
    Journal of Electronics Manufacturing, Vol. 9, No. 2, 2000, pp. 99-106.
    [pdf]

1998
  • Forced Convection Cooling Inside an Electronics Enclosure,
    Refai-Ahmed, G, Culham, J.R. and Cooper, D.,
    Electronics Cooling, Vol. 4, No. 2, 1998, pp. 26-29.
    [pdf]

  • Analytical Modeling of Spreading Resistance in Flux Tubes, Half Spaces and Compound Disks,
    Yovanovich, M.M., Culham, J.R., and Teertstra, P.,
    IEEE Transactions on Components,Packaging and Manufacturing Technology, Part A, Vol. 21, No. 1, 1998, pp. 168-176.
    [pdf]

  • Factors Affecting the Calculation of Effective Conductivity in Printed Circuit Boards,
    Culham, J.R. and Yovanovich, M.M.,
    Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, Washington, May 27-30, 1998, pp. 460-467.
    [pdf]

  • Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels,
    Yovanovich, M.M., Muzychka, Y.S., Culham, J.R.,
    6th AIAA Aerospace Sciences Meeting and Exhibit, Reno, NV, January 12-15, 1998.
    [pdf]

1997
  • Pressure Loss Modeling for Surface Mounted Cuboid-Shaped Packages in Channel Flow,
    Teertstra, P., Yovanovich, M.M., and Culham, J.R.,
    IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 4, 1997, pp. 463-469.
    [pdf]

  • Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Microelectronic Systems,
    Teertstra, P., Culham, J.R. and Yovanovich, M.M.,
    Journal of Electronics Manufacturing, Vol. 7, No. 2, 1997, pp. 70-92.
    [pdf]

  • Natural Convection From Horizontal Circular and Square Toroids and Equivalent Cylinders,
    Yovanovich, M.M., Culham, J.R. and Lee, S.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 11, No. 3, 1997, pp. 415-422.
    [pdf]

  • Calculating Interface Resistance,
    Yovanovich, M.M., Culham, J.R. and Teertstra, P.
    Electronics Cooling, Vol. 3, No. 2, 1997, pp. 24-29.
    [pdf]

  • Experimental and Approximate Analytical Study of Forced Convection From Isothermal Spheres,
    Refai Ahmed, G., Culham, J.R. and Yovanovich, M.M.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 11, No. 2, 1997, pp. 223-231.
    [pdf]

1996
  • Modeling Thermal Resistances of Diamond Spreaders on Copper Heat Sinks,
    Yovanovich, M.M., Teertstra, P. and Culham, J.R.,
    International Electronics Packaging Conference, Austin, TX, September 29 - October 2, 1996.
    [pdf]

1995
  • Thermal Modeling of Isothermal Cuboids and Rectangular Heat Sinks Cooled by Natural Convection,
    Culham, J.R., Lee, S. and Yovanovich, M.M.,
    IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No. 3, 1995, pp. 559-566.
    [pdf]

  • Modeling Transient Conduction From Isothermal Convex Bodies of Arbitrary Shape,
    Yovanovich, M.M., Teertstra, P. and J.R. Culham,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 9, No. 3, July-September 1995, pp. 385-390. Originally presented at AIAA/ASME 6th Thermophysics and Heat Transfer Conference, Colorado Springs, CO, June 20-23, 1994.
    [pdf]

  • Analytical Model for Simulating the Thermal Behavior of Microelectronic Systems,
    Teertstra, P., Culham, J.R., Yovanovich, M.M. and Lee, S.,
    Proceedings of the ASME International Intersociety Electronic Packaging Conference - INTERpack '95, EEP - Vol. 10-2, Maui, Hawaii, 1995, pp. 927-936.
    [pdf]

  • An Investigation of the Relationship between Packaging Density and Effective Thermal Conductivity in Laminated Printed Circuit Boards
    Teerstra, P., Culham, J.R., and Yovanovich, M.M.,
    XXth International Electronic Packaging Society, San Diego, CA, Sept. 24-27, 1995.
    [pdf]

1993
  • Conjugate Heat Transfer From a Raised Isothermal Heat Source Attached to a Vertical Board,
    Culham, J.R., Lee, S. and Yovanovich, M.M.,
    Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, Austin TX, February 2-4, 1993.
    [pdf]

1992
  • Printed Circuit Board Trace Thermal Analysis and Effective Conductivity,
    Lemczyk, T.F., Mack, B.L., Culham, J.R. and Yovanovich, M.M.,
    ASME Journal of Electronic Packaging, Vol. 114, December, 1992, pp. 413-419.
    [pdf]

  • Thermal Simulation of Electronic Systems with Non-Uniform Inlet Velocities,
    Culham, J.R., Lee, S., Jeakins, W.D. and Yovanovich, M.M.,
    EEP-Vol. 3, Computer Applications in Electronic packages, 113th ASME Winter Annual Meeting, Anaheim, California, November 8 - 12, 1992, pp. 33-40.
    [pdf]

  • Fopt - A Thermal Optimization Factor for Microelectronic Packages,
    Lemczyk, T.F., Culham, J.R., Lee, S., and Yovanovich, M.M.,
    8th Annual IEEE Semiconductor Temperature and Thermal Management Symposium (SEMI-THERM VIII), Austin, TX, February 3-5, 1992, pp. 89-94.
    [pdf]

1991
  • Thermal Analysis of Microelectronic Packages,
    Lemczyk, T.F., Culham, J.R., and Yovanovich, M.M.,
    Paper 91 - WA/EEP-6, 1991 ASME Winter Annual Meeting, Atlanta, Georgia, December 1-6, 1991.
    [pdf]

  • The Effect of Common Design Parameters on the Thermal Performance of Microelectronic Equipment: Part I-Natural Convection,
    Lee, S., Culham, J.R. and Yovanovich, M.M.,
    ASME National Heat Transfer Conference, Minneapolis, MN, July, 28-31, 1991. Heat Transfer in Electronic Equipment, 1991, HTD-Vol. 171, pp. 47-54. ASME New York, NY, 1991. Edited by A. Ortega, D. Agonafer and B. W. Webb.
    [pdf]

  • The Effect of Common Design Parameters on the Thermal Performance of Microelectronic Equipment: Part II-Forced Convection,
    Culham, J.R., Lee, S. and Yovanovich, M.M.,
    ASME National Heat Transfer Conference, Minneapolis, MN, July, 28-31, 1991. Heat Transfer in Electronic Equipment, 1991, HTD-Vol. 171, pp. 55-62. ASME New York, NY, 1991. Edited by A. Ortega, D. Agonafer and B. W. Webb.
    [pdf]

  • Parametric Investigation of Conjugate Heat Transfer From Microelectronic Circuit Boards Under Mixed Convection Cooling,
    Lee, S., J.R. Culham and Yovanovich, M.M.,
    International Electronic Packaging Conference, San Diego, California, September 15-19, 1991, pp. 428-446.
    [pdf]

  • META - A Conjugate Heat Transfer Model for Air Cooling of Circuit Boards With Arbitrarily Located Heat Sources,
    Culham, J.R., Lemczyk, T.F., Lee, S., and Yovanovich, M.M.,
    ASME National Heat Transfer Conference, Minneapolis, MN, July 28-31, 1991. Heat Transfer in Electronic Equipment, 1991, HTD-Vol. 171, pp. 117-126. ASME New York, NY, 1991. Edited by A. Ortega, D. Agonafer and B. W. Webb.
    [pdf]

1989
  • Analysis of Three-Dimensional Conjugate Heat Transfer Problems in Microelectronics,
    Lemczyk, T.F., Culham, J.R. and Yovanovich, M.M.,
    Sixth International Conference on Numerical Methods in Thermal Problems, Swansea, Wales, United Kingdom, July 3-7, 1989, pp. 1346-1356.
    [pdf]

1988
  • Simplified Solutions to Circular Annular Fins with Contact Resistance and End Cooling,
    Yovanovich, M.M., Culham, J.R. and Lemczyk, T.F.,
    AIAA Journal of Thermophysics and Heat Transfer, Vol. 2, No. 2, 1988, pp. 152-157.
    [pdf]

  • Experimental Study: Effect of Surface Orientation on Mixed Convection Heat Transfer from Discrete Sources on Conducting Plates,
    Culham, J.R. and Yovanovich, M.M.,
    International Centre for Heat and Mass Transfer XXth International Symposium, -- Heat Transfer in Electronic and Microelectronic Equipment, Dubrovnik, Yugoslavia, August 29 - September 2, 1988.
    [pdf]

  • Correlation of Thermal Parameters Influencing the Differences Between One and Two Dimensional Conduction Within PCB's,
    Fast, D.W., Yovanovich, M.M. and Culham, J.R.,
    Cooling Technology for Electronic Equipment, Hemisphere Publishing Corporation, New York, 1988, pp. 505-512. Edited by Win Aung.
    [pdf]

1987
  • Non-Iterative Technique for Computing Temperature Distributions in Flat Plates with Distributed Sources and Convective Cooling,
    Culham, J.R. and Yovanovich, M.M.,
    Second ASME--JSME Thermal Engineering Joint Conference, Honolulu, Hawaii, March 22-27, 1987, pp. 403-409.
    [pdf]

1986
  • Thermal Analysis of Circular Annular Configurations with Distributed Heat Sources,
    Culham, J.R., Yovanovich, M.M. and Graham, K.D.,
    Sixth Annual International Electronics Packaging Society Conference, San Diego, California, November 17-19, 1986.
    [pdf]

1984
  • The Effects of Unbalanced Flow on the Thermal Performance of Collector Arrays,
    Culham, J.R. and Sauer, P.,
    J. Sol. Energy Eng., Transactions of the ASME, Vol. 106, No. 2, 1984.
    [NA]

1980
  • Low Cost Solar Selective Chromate Conversion Coatings Applied to Stainless Steel,
    Culham, J.R. and Niessen, P.,
    J. Sol. Energy Eng., Transactions of the ASME, Vol. 102, No. 3, pp. 188-191, 1980.
    [NA]

  • A British Columbia Perspective of Solar Heating,
    Hill, J. and Culham, J.R.,
    SOLWEST 80 Conference Proceedings, August 6-10, 1980.
    [NA]

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Most recent update: 10-18-05