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MHTL Presentation Archive

 

AIAA
San Francisco'2006
  • Effect of Bypass on Overall Performane of Pin-Fin Heat Sinks,
    Yovanovich, M.M., W.A. Khan and Culham, J.R.,
    AIAA/ASME Joint Thermophysics and Heat Transfer Conference, San Francisco, CA, June 5 - 8, 2006.
    [pdf]

  • Approximate Solution for Pressure Drop in Microchannels of Arbitrary Cross-Sections,
    Bahrami, M., Yovanovich, M.M. and Culham, J.R.
    AIAA/ASME Joint Thermophysics and Heat Transfer Conference, San Francisco, CA, June 5 - 8, 2006.
    [pdf]

Reno'2006
  • Optimal Design of Tube Banks in Crossflow Using Entropy Generation Minimization Method,
    Yovanovich, M.M., W.A. Khan and Culham, J.R.,
    AIAA 44th Aerospace Sciences Meeting and Exhibit, Reno, NV, January 9-12, 2006.
    [pdf]

  • Micro and Macro Hardness Measurements, Correlations and Contact Models,
    Yovanovich, M.M.,
    AIAA 44th Aerospace Sciences Meeting and Exhibit, Reno, NV, January 9-12, 2006.
    [pdf]

Reno'2005
  • Analytical Modeling of Natural Convection in Horizontal Annuli,
    Teertstra, P., Yovanovich, M.M., and Culham, J.R.,
    AIAA 43rd Aerospace Sciences Meeting and Exhibit, Reno, NV, January 10-13, 2005.
    [pdf]

  • Convection Heat Transfer From Tube Banks in Crossflow: Analytical Approach,
    Yovanovich, M.M., Khan, W.A., and Culham, J.R.,
    AIAA 43rd Aerospace Sciences Meeting and Exhibit, Reno, NV, January 10-13, 2005.
    [pdf]

Portland'2004
  • Fluid Flow and Heat Transfer From Elliptical Cylinders: Analytical Approach,
    Yovanovich, M.M., Khan, W.A., and Culham, J.R.,
    AIAA 37th Thermophysics Conference, Portland, OR, June 28 - July 1, 2004.
    [pdf]

Reno'2004
  • Thermal Resistances of Gaseous Gap for Conforming Rough Contacts,
    Bahrami, M., Culham, J.R., and Yovanovich, M.M.,
    AIAA 42rd Aerospace Sciences Meeting and Exhibit, Reno, NV, January 5-8, 2004.
    [pdf]

  • Thermal Resistances of Gaseous Gap for Non-Conforming Rough Contacts,
    Bahrami, M., Culham, J.R., and Yovanovich, M.M.,
    AIAA 42rd Aerospace Sciences Meeting and Exhibit, Reno, NV, January 5-8, 2004.
    [pdf]

Orlando'2003
  • Thermal Contact Resistance of Non-Conforming Rough Surfaces Part 1: Contact Mechanics Model,
    Bahrami, M., Culham, J.R., Yovanovich, M.M., and Schneider, G.E.,
    36th AIAA Thermophysics Conference, Orlando, Florida, June 23-26, 2003.
    [pdf]

  • Thermal Contact Resistance of Non-Conforming Rough Surfaces Part 2: Thermal Model,
    Bahrami, M., Culham, J.R., Yovanovich, M.M., and Schneider, G.E.,
    36th AIAA Thermophysics Conference, Orlando, Florida, June 23-26, 2003.
    [pdf]

Reno'2003
  • Conduction Shape Factor Models for 3-D Enclosures,
    Teertstra, P., Yovanovich, M.M., and Culham, J.R.,
    AIAA 41st Aerospace Sciences Meeting and Exhibit, Reno, NV, January 6-9, 2003.
    [pdf]

Denver'2000
  • Natural Convection from Isothermal Convex Bodies: Simple Models for Bounds on Body-Gravity Function,
    Yovanovich, M.M.,
    34th AIAA Thermophysics Conference, Denver, CO, June 19-22, 2000.
    [pdf]

ASME
IJTC'2004
  • A Compact Model for Spherical Rough Contacts,
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    ASME/STLE International Joint Tribology Conference, Long Beach, CA, October 24-27, 2004.
    [pdf]

Charlotte'2004
  • Models and Experiments for Laminar Natural Convection from Heated Bodies in Enclosures,
    Teertstra, P., Yovanovich, M.M., and Culham, J.R.,
    ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC, July 11-15, 2004.
    [pdf]

Las Vegas'2003
  • Review of Thermal Joint Resistance Models for Non-Conforming Rough Surfaces in a Vacuum,
    Bahrami, M., Culham, J.R., Yovanovich, M.M., and Schneider, G.E.,
    ASME Summer Heat Transfer Conference, Las Vegas Nevada, July 21-23, 2003.
    [pdf]

IMECE
2004
  • Compact Analytical Models for Effective Thermal Conductivity of Rough Spheroid Packed Beds,
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    ASME International Mechanical Engineering Congress, Anaheim, CA, November 13-19, 2004.
    [pdf]

  • Modeling of Thermal Joint Resistance of Polymer-Metal Rough Interfaces,
    Bahrami, M., Yovanovich, M.M., and Marotta, E.E.,
    ASME International Mechanical Engineering Congress, Anaheim, CA, November 13-19, 2004.
    [pdf]

  • Experimental and Analytical Investigation of Compact Liquid Cooled Heat Sinks,
    Zugic, M., Culham, J.R., and Teertstra, P.,
    ASME International Mechanical Engineering Congress, Anaheim, CA, November 13-19, 2004.
    [pdf]

2003
  • A Scale Analysis Approach to Thermal Contact Resistance,
    Yovanovich, M.M., Bahrami, M., and Culham, J.R.,
    ASME International Mechanical Engineering Congress and RD Expo, Washington, DC, Nov. 15-21, 2003.
    [pdf]

1999
  • Review of Thermal Models for Conduction and Convection in Microelectronic Components, Packages and Systems,
    Yovanovich, M.M.,
    ASME International Mechanical Engineering Congress and RD Expo, Nashville, TN, November 1999.
    [pdf]

InterPACK
2003
  • The Role of Fin Geometry in Heat Sink Performance,
    Culham, J.R., Khan, W.A., and Yovanovich, M.M.,
    InterPACK2003, International Electronic Packaging Technical Conference and Exhibit, Maui, Hawaii, July 6-11, 2003.
    [pdf]

ITherm
2004
  • Modeling of Natural Convection in Electronic Enclosures,
    Teertstra, P., Yovanovich, M.M., and Culham, J.R.,
    Ninth Intersociety Conference on Thermal and Thermechanical Phenomena in Electronic Systems, Las Vegas, NV, USA, June 1-4, 2004.
    [pdf]

  • Optimization of Pin-Fin Heat Sinks Using Entropy Generation Minimization,
    Khan, W.A., Culham, J.R., and Yovanovich, M.M.,
    Ninth Intersociety Conference on Thermal and Thermechanical Phenomena in Electronic Systems, Las Vegas, NV, USA, June 1-4, 2004.
    [pdf]

2002
  • Design, Assembly and Commissioning of a Test Apparatus for Characterizing Thermal Interface Materials,
    Culham, J.R., Teertstra, P., Savija, I., and Yovanovich, M.M.,
    Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA USA, May 29 - June 1, 2002.
    [pdf]

2000
  • Thermal-Mechanical Models for Non-Conforming Surface Contacts,
    Yovanovich, M.M.,
    Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV USA, May 25-28, 2002.
    [pdf]

SemiTherm
2006
  • Optimization of Microchannel Heat Sinks Using Entropy Generation Minimization Method,
    Yovanovich, M.M., Khan, W.A. and Culham, J.R.,
    Twenty Second Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), Dallas, TX, March 14-16, 2006.
    [pdf]

  • Thermal Resistance-Based Bounds for the Effective Conductivity of Composite Thermal Interface Materials,
    Karayacoubian, P., Yovanovich, M.M. and Culham, J.R.,
    Twenty Second Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), Dallas, TX, March 14-16, 2006.
    [pdf]

2005
  • In-situ Thickness Method of Measuring Thermo-Physical Properties of Polymer-Like Thermal Interface Materials,
    Smith, R. and Culham, J.R.,
    Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), San Jose, CA, March 15-17, 2005.
    [pdf]

  • Modeling of Cylindrical Pin-Fin Heat Sinks for Electronic Packaging,
    Khan, W., Culham, J.R., and Yovanovich, M.M.,
    Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), San Jose, CA, March 15-17, 2005.
    [pdf]

  • Thermal Contact Resistance: Effect of Elastic Deformation,
    Bahrami, M., Yovanovich, M.M., and Culham, J.R.,
    Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), San Jose, CA, March 15-17, 2005.
    [pdf]

1999
  • Analytical Forced Convection Modeling of Plate Fin Heat Sinks,
    Teertstra, P., Yovanovich, M.M., Culham, J.R., and Lemczyk, T.F.,
    Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), San Diego, CA, March 9, 1999.
    [pdf]

CMAC
2001
  • Overview of Research Experience and Capabilities,
    Culham, J.R., Yovanovich, M.M., and Teertstra, P.,
    CMAC Introductory Presentation, Kanata, ON, December 6, 2001.
    [pdf]

CMAP
2005
  • Extending the Limits of Air Cooling for Microelectronics Systems,
    Culham, J.R., Teertstra, P., Hossain, R., and Banik, A.,
    CMAP Year 1 Project Review, February 10, 2005.
    [pdf]

  • Modeling of Thermally Enhanced Greases: Preliminary Findings,
    Culham, J.R., Teertstra, P., and Karayacoubian, P.,
    CMAP Year 1 Project Review, February 10, 2005.
    [pdf]

2003
  • Overview of Research Experience and Capabilities,
    Culham, J.R. and Teertstra, P.,
    CMAP Workshop on Thermal Issues, March 13, 2003.
    [pdf]

2001
  • Development of Conduction, Convection, Spreading and Contact Resistance Models for Microelectronics Applications,
    Culham, J.R., Yovanovich, M.M., and Teertstra, P.,
    CMAP 1st Annual Project Review, October 17, 2001.
    [pdf]

  • Development of Conduction, Convection, Spreading and Contact Resistance Models for Microelectronics Applications,
    Culham, J.R., Yovanovich, M.M., and Teertstra, P.,
    CMAP 1st Annual Project Review, Decemeber 7, 2001.
    [pdf]

  • Testing of Thermal Interface Materials: Preliminary Observations,
    Culham, J.R., Yovanovich, M.M., and Teertstra, P.,
    CMAP 1st Annual Project Review, October 17, 2001.
    [pdf]

1999
  • Microelectronics Heat Transfer Laboratory,
    Culham, J.R., Yovanovich, M.M., and Teertstra, P.,
    CMAP Workshop, November 8, 1999.
    [pdf]

  • University of Waterloo Introduction,
    Yovanovich, M.M.,
    CMAP Toronto Microelectronics Packaging Workshop, November 8, 1999.
    [pdf]

COPA
2004
  • Thermal Modeling and Analysis for Optoelectronic Packaging,
    Culham, J.R.,
    Centre for Optoelectronics Packaging and Assembly, Optoelectronics Packaging and Assembly: The Next Generation, July 2004.
    [pdf]

Dalsa
2000
  • Introduction to the Microelectronics Heat Transfer Laboratory,
    Culham, J.R. and Teertstra, P.,
    Dalsa, June 2000.
    [pdf]

Dupont
2002
  • Overview of Research Experience and Capabilities,
    Culham, J.R., Teertstra, P., and Smith, A.,
    Dupont Canada, Kingston, October 24, 2004.
    [pdf]

MMO
2004
  • Design and Manufacturing Research for a Lean World Workshop,
    Culham, J.R.,
    Analytical Models as Design Tools for Electronics Cooling Applications, MMO/OCE Inc. Partnerships, June 22, 2004.
    [pdf]

1999
  • Thermal Issues in Electronics Applications,
    Culham, J.R.,
    MMO Introductory Presentation.
    [pdf]

  • Approximate Modelling Procedures for Rapid Analysis and Design,
    Culham, J.R.,
    MMO Workshop Presentation, December 1999.
    [pdf]

Waterloo
1999
  • Thermal Design and Optimization of Heat Sinks,
    Culham, J.R.,
    Presentation to the Department of Mechanical Engineering, University of Waterloo, September 2000.
    [pdf]

UT-Arlington
1999
  • Thermal Modeling Alternatives For a New Generation of Electronic Equipment,
    Culham, J.R.,
    Presentation to the Department of Mechanical Engineering, University of Texas at Arlington, 1999.
    [pdf]

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© by Richard Culham
Most recent update: 10-18-05